J-Pac Medical has a broad array of medical device assembly processes required by many of today’s medical and diagnostics devices. Our capabilities include RF and ultrasonic welding, thermoforming, die cutting, laser cutting, solvent bonding, sewing, laminating, liquid and solid filling, plus many others. All of our manufacturing processes are geared toward manufacturing and assembly of single-use medical and diagnostic devices containing multiple thermoplastic components. We have Class 7 and 8 cleanrooms as well as a dry cleanroom (<35% RH) for moisture sensitive devices. These assembly capabilities are applied to Class II and Class III medical devices, biomaterial implants, and microfluidic IVD reagent blisters.